From December 21st to 22nd, 2017, the 2017 High-Tech LED Annual Meeting and Golden Globe Awards Ceremony, hosted by Gaogong LED, took place in Shenzhen Baoan Dunxi Road. The event focused on the theme of “Deepening the smoke and softening the strength and deep integration and tapping new opportunities,†marking a significant gathering for industry leaders and professionals.
As a major year-end event in the LED industry chain, the 2017 High-Tech LED Annual Meeting brought together over 400 industry elites. Discussions centered around the future landscape of the LED industry, including market trends, capital movements, technological advancements, and strategies for deep integration. Participants explored new opportunities and solutions to achieve a "decisive victory" for both the industry and enterprises.
On the morning of December 22nd, a special forum titled “LED Packaging Equipment and Materials: Changes and Unchanged Materials†was held. Representatives from various companies, such as Xinyichang’s Zhang Qinglang, Xin Yichang’s Yuan Manbao, Kangmet’s Ma Jing, Chenri Technology’s Qian Xuexing, Liyang’s Yang Jian, Ye Shanghui from Zhongke Core Source, and Guoxing Optoelectronics’ Li Cheng, shared insights on evolving material technologies and intelligent packaging solutions.
The event featured an engaging panel discussion where key figures addressed critical questions about smart manufacturing and its impact on the industry. Li Cheng from Guoxing Optoelectronics emphasized that smart manufacturing is not just about automation but also about optimizing input-output ratios. He explained how digital transmission and robotic interconnection can enhance efficiency without altering core processes.
Hongli Zhihui’s Li Guoping highlighted the urgent need for intelligent packaging solutions, especially with expanding operations in Nanchang. He mentioned that while South Korea’s LG factory is fully automated, achieving similar results in China remains challenging. Zhang Qinglang from Xinyichang outlined the three stages of smart manufacturing, emphasizing the importance of integrating equipment and streamlining workshop processes.
Yuan Manbao from Xinyichang suggested that intelligence should focus on improving efficiency, connecting equipment, and eventually enabling remote monitoring of production lines. Li Cheng also pointed out that while equipment is available, what the industry lacks is comprehensive system planning, urging manufacturers to provide holistic solutions rather than just machines.
In terms of material requirements, Li Cheng outlined three main goals: cost reduction, performance improvement in high-end products, and the development of new materials for emerging fields like infrared and deep ultraviolet LEDs. Hongli Zhihui’s Li Guoping added that materials have become more price-sensitive due to increased competition.
Commet’s Ma Jing expressed confidence in their SMC technology, noting that it has been successfully tested in several large domestic factories. Qian Xuexing from Chenri Technology discussed the potential for cost reductions through flip-chip technology and emphasized the importance of localized material development.
Looking ahead, Zhongke Core Source’s Ye Shanghui shared plans to develop high-power light sources for applications like stadium lighting, while Liyang’s Yang Jian highlighted the company's focus on multi-color integration and low-color-temperature lighting solutions for the future.
Overall, the event provided valuable insights into the direction of the LED industry, highlighting the growing emphasis on smart manufacturing, material innovation, and strategic collaboration among industry players. As the sector continues to evolve, the need for integrated solutions and efficient production methods will remain at the forefront of discussions.
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