New Yichang title special roundtable dialogue: What is the evolution of packaging materials technology and products? To what extent is smart manufacturing packaged into lighting?

From December 21st to 22nd, 2017, the 2017 High-Tech LED Annual Meeting and Golden Globe Awards Ceremony, organized by Gaogong LED, took place in Shenzhen Baoan Dunxi Road. The event focused on the theme of “Deepening the Smoke and Softening the Strength, and Deep Integration to Tap New Opportunities.” It was a significant gathering that brought together industry leaders, experts, and professionals to discuss the future of the LED sector. As a key year-end event for the LED industry chain, the meeting attracted over 400 industry elites. They engaged in in-depth discussions about the future landscape, market trends, capital movements, and technological advancements. The session also aimed to explore new opportunities and strategies under the current industrial conditions, with a focus on solving challenges faced by both the industry and enterprises. On the morning of December 22nd, a special forum titled “LED Packaging Equipment and Materials: Changes and Unchanged Materials” was held. Experts from various companies, including Zhang Qinglang, Research and Development Director at Xinyichang; Yuan Manbao, Deputy General Manager of Xinyichang; Ma Jing, Deputy General Manager of Kangmet; Qian Xuexing, General Manager of Chenri Technology; Yang Jian, Deputy General Manager of Liyang; Ye Shanghui, General Manager of Zhongke Core Source; and Li Cheng, Deputy General Manager of Guoxing Optoelectronics, shared insights on evolving material technologies and the future of intelligent packaging in lighting. An image was displayed during the event, showcasing an engaging moment from the forum. Following the discussions, several notable perspectives were shared: Zhang Xiaofei, Chairman of Gaogong LED, asked Li Cheng, Deputy General Manager of Guoxing Optoelectronics, about the current state of smart manufacturing and its impact on product development. Li Cheng explained that while smart manufacturing is a direction forward, it's not just about replacing human labor with machines but improving efficiency through digital integration and automation. Li Cheng also emphasized the importance of balancing investment and output, noting that reducing labor costs through automation could save millions over time. He mentioned that while some processes can be automated, not all steps can be fully integrated due to varying environmental and operational requirements. Li Guoping, Chairman of Hongli Zhihui, highlighted the urgent need for intelligent packaging solutions, especially as their Nanchang expansion aims to reduce labor costs. However, he noted that achieving full automation remains challenging, and they are looking for equipment manufacturers to provide tailored solutions. Zhang Qinglang, R&D Director at Xinyichang, discussed the first stage of intelligentization, which involves digitization and information integration. He mentioned that even without making machines themselves, they are working on integrating systems to reduce manual input and improve efficiency. Yuan Manbao, Deputy General Manager of Xinyichang, outlined a three-step approach to intelligence: first, improving efficiency through equipment; second, connecting devices across the workshop; and third, achieving full smart management through data monitoring and control. Li Cheng also pointed out that while equipment is available, what is lacking is a comprehensive system plan. He urged equipment manufacturers to focus on providing holistic solutions rather than just selling machines. When asked about the main requirements for Guoxing Optoelectronics and Hongli Zhihui, Li Cheng emphasized cost reduction, performance improvement in high-end products, and the need for new materials to support emerging applications like UV and infrared LEDs. Ma Jing, Deputy General Manager of Commet, expressed confidence in their SMC technology, citing successful implementations in major factories and a commitment to competitive pricing and performance. Qian Xuexing, General Manager of Chenri Technology, discussed the potential of flip-chip technology to reduce material costs further, depending on the maturity of the process. Looking ahead to 2018, Ye Shanghui, General Manager of Zhongke Core Source, mentioned plans to develop high-power light sources for specialized applications, such as stadium lighting. Yang Jian, Deputy General Manager of Liyang, spoke about focusing on multi-color integration and low color temperature lighting solutions, which he believes will become the standard in outdoor lighting. The event concluded with a sense of optimism and collaboration, highlighting the ongoing transformation of the LED industry through innovation, integration, and smart manufacturing.

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