On February 12, 2015, the US International Trade Commission (ITC) voted to officially launch 337 investigations on some LED products and their similar components, including LED bulbs and LED chips. For a time, the industry is at a loss, and the patent battle in the LED field is on the verge. For the LED chip, the sapphire substrate technology is controlled by Nichia, and the US Cree dominates the silicon carbide substrate technology. In the silicon substrate technology, China has embarked on a domestically produced chip road with core intellectual property rights, gradually breaking Japan and Strong patent barriers formed by European and American LED manufacturers. Therefore, in the recent "two sessions", the Jiangxi delegation proposed to promote the industrialization of silicon substrate LEDs as a national strategy.
The silicon substrate LED manufacturing technology is a third LED chip manufacturing technology route different from sapphire and silicon carbide substrates, and has four advantages compared with the other two methods. First, the silicon material is cheaper than sapphire and silicon carbide, and the production efficiency is higher, so the cost is low, the LED chip cost can be greatly reduced compared with the sapphire substrate chip; the second is that the device has excellent performance, and the chip has good antistatic performance. Long life, high current density can withstand; Third, the chip packaging process is simple, the chip is the upper and lower electrodes, the single-lead vertical structure, only a single-electrode lead is needed in the device packaging, which simplifies the packaging process and saves the packaging cost; Intellectual property, products can be sold to the international market, and are not subject to international patent restrictions.
Although the silicon substrate technology has a good development prospect, there are some technical difficulties in the process of industrialization. Due to the large lattice mismatch and thermal mismatch between the GaN epitaxial material and the silicon substrate, the epitaxial material has many defects and many cracks, which ultimately leads to problems such as low device yield, low luminous efficiency and poor reliability.
Due to the many advantages of silicon substrates, many units or research institutions in the world have stepped up their pace of technology research and development. Since 2011, Purui Optoelectronics has shifted its research and development focus to silicon substrate technology; a large number of well-known companies and research institutions such as Samsung, LG, San Francisco Electric, Cambridge University, and Madberg University have also “entered†silicon substrates. Technology; Toshiba invested heavily in 2012 and acquired the silicon technology division of Purui, Inc.; recently, Crystal obtained the ALLOS Semiconductors silicon-based LED license and successfully completed the first phase of technology transfer. Faced with the competitive pressure of international enterprises, China should maintain its first-mover advantage and enhance the international competitiveness of its own brands.
Strengthen the industrial chain to promote positive interaction silicon substrate technology collaborative innovation <br> <br> First joint research guide upstream and downstream enterprises, supporting the silicon substrate to achieve the overall chip. Due to the particularity of the silicon substrate chip package, the package form and method are somewhat different from those of the sapphire substrate. At present, most LED packaging companies in China are supporting sapphire substrate chips, which restricts the large-scale promotion of silicon substrates. It is necessary to strengthen guidance and focus on supporting the upstream and downstream backbone enterprises of silicon substrates to carry out strategic cooperation, carry out joint research, and achieve concentrated breakthroughs in key technologies.
The second is to promote technological innovation in silicon substrates and enhance the competitiveness of chips. Compared to sapphire substrates, silicon substrate chips have similar levels of efficacy in high-power chips, but further optimization of uniformity, uniformity, and reliability is needed. At the same time, one of the advantages of the silicon substrate is that the substrate area is not limited, and the substrate size should be accelerated to 6-inch or even 8-inch industrialization, further reducing the manufacturing cost and increasing the price advantage.
The third is to strengthen the application and promotion of domestic equipment and realize the localization and penetration of silicon substrate chips. Support the verification and development of key sets of domestically produced equipment in the development of silicon substrates, including supporting research and development of equipment used in various aspects of silicon substrates such as MOCVD equipment, lithography machines, etching machines, packaging equipment, etc., gathering multi-party resources, and orderly promoting domestically. The promotion and application of silicon substrate LED chips will increase market share.
Increase application marketing efforts to carry out the silicon substrate differentiated brand building <br> <br> First, tap the market segments, to avoid the homogenization of competition. Silicon substrate chips are mainly used in "one big and one small", that is, they have great advantages in high-power chips and small-size chip applications. High-power chips should expand the outdoor special LED lighting market, encourage enterprises to further identify the development direction of tunnel sub-division, street lighting, landscape lighting and other sub-application areas; small-size chips should face backlight and display application needs, develop LCD backlight Source and small pitch display market applications. Refine the application of silicon substrate chips to avoid low-cost vicious competition with sapphire chips in the same application.
The second is to target emerging applications and seize the opportunities for development. Pioneering the research and development of silicon-based LED chips in the fields of intelligent lighting systems, eco-agriculture, healthcare, automotive lighting, etc., encourage enterprises to target new application areas to carry out technological innovation and seize opportunities for development. Support the organization of silicon substrate technology related forums, to meet the needs of users, increase publicity, and enhance users' awareness and popularity of silicon substrate chips.
The third is to innovate business models and build their own brands. Encourage silicon-based LED companies to explore new profit models, leverage the advantages of the Internet, online sales, offline experience and services, and enhance cooperation in all aspects of the industry chain. Guide enterprises to identify the market positioning, starting from the aspects of ideology, system construction and capital investment, taking innovation as the core, quality as the life, market as the touchstone, and policy as the support, comprehensively adopting various methods to actively promote silicon Brand building work for substrate chips.
Pay attention to intellectual property protection and improve the silicon substrate LED chip quality inspection system <br> <br> First, innovation-driven technology research and development, strengthen the core patent portfolio. China has more than 200 patents related to silicon-based LED chips, mainly inventing patents. Innovation should be used to drive technological innovation, apply for patents, foster commercial logos, and improve independent intellectual property rights. Encourage enterprises to pay attention to patent layout, with silicon substrate LED technology as the core, and lay out patent networks in various fields such as epitaxial growth, chip manufacturing, packaging and application, and enhance patent barriers to foreign countries.
The second is to formulate an intellectual property strategy to enhance awareness of early warning. The patent war in the LED field has been launched at a glance, and intellectual property has become a means of competition. Enterprises should be encouraged to effectively use intellectual property rights, formulate a strategic system, establish an early warning mechanism for intellectual property rights, monitor patent dynamic information of key foreign competitors, and reduce intellectual property risks in the whole process before, during and after R&D.
The third is to strengthen product quality supervision and improve LED chip testing indicators. At present, the quality of LED chips on the market is mixed. The national and local quality supervision and inspection centers should be strengthened to strengthen market regulation and supervision. The LED chips should be inspected regularly for safety, energy conservation and environmental protection, and public exposure and punishment should be imposed on non-standard enterprises. Enterprises strengthen their own management and technology to improve product quality. Further establish a third-party testing platform with international advanced level to improve testing capabilities and levels.
The silicon substrate LED manufacturing technology is a third LED chip manufacturing technology route different from sapphire and silicon carbide substrates, and has four advantages compared with the other two methods. First, the silicon material is cheaper than sapphire and silicon carbide, and the production efficiency is higher, so the cost is low, the LED chip cost can be greatly reduced compared with the sapphire substrate chip; the second is that the device has excellent performance, and the chip has good antistatic performance. Long life, high current density can withstand; Third, the chip packaging process is simple, the chip is the upper and lower electrodes, the single-lead vertical structure, only a single-electrode lead is needed in the device packaging, which simplifies the packaging process and saves the packaging cost; Intellectual property, products can be sold to the international market, and are not subject to international patent restrictions.
Although the silicon substrate technology has a good development prospect, there are some technical difficulties in the process of industrialization. Due to the large lattice mismatch and thermal mismatch between the GaN epitaxial material and the silicon substrate, the epitaxial material has many defects and many cracks, which ultimately leads to problems such as low device yield, low luminous efficiency and poor reliability.
Due to the many advantages of silicon substrates, many units or research institutions in the world have stepped up their pace of technology research and development. Since 2011, Purui Optoelectronics has shifted its research and development focus to silicon substrate technology; a large number of well-known companies and research institutions such as Samsung, LG, San Francisco Electric, Cambridge University, and Madberg University have also “entered†silicon substrates. Technology; Toshiba invested heavily in 2012 and acquired the silicon technology division of Purui, Inc.; recently, Crystal obtained the ALLOS Semiconductors silicon-based LED license and successfully completed the first phase of technology transfer. Faced with the competitive pressure of international enterprises, China should maintain its first-mover advantage and enhance the international competitiveness of its own brands.
Strengthen the industrial chain to promote positive interaction silicon substrate technology collaborative innovation <br> <br> First joint research guide upstream and downstream enterprises, supporting the silicon substrate to achieve the overall chip. Due to the particularity of the silicon substrate chip package, the package form and method are somewhat different from those of the sapphire substrate. At present, most LED packaging companies in China are supporting sapphire substrate chips, which restricts the large-scale promotion of silicon substrates. It is necessary to strengthen guidance and focus on supporting the upstream and downstream backbone enterprises of silicon substrates to carry out strategic cooperation, carry out joint research, and achieve concentrated breakthroughs in key technologies.
The second is to promote technological innovation in silicon substrates and enhance the competitiveness of chips. Compared to sapphire substrates, silicon substrate chips have similar levels of efficacy in high-power chips, but further optimization of uniformity, uniformity, and reliability is needed. At the same time, one of the advantages of the silicon substrate is that the substrate area is not limited, and the substrate size should be accelerated to 6-inch or even 8-inch industrialization, further reducing the manufacturing cost and increasing the price advantage.
The third is to strengthen the application and promotion of domestic equipment and realize the localization and penetration of silicon substrate chips. Support the verification and development of key sets of domestically produced equipment in the development of silicon substrates, including supporting research and development of equipment used in various aspects of silicon substrates such as MOCVD equipment, lithography machines, etching machines, packaging equipment, etc., gathering multi-party resources, and orderly promoting domestically. The promotion and application of silicon substrate LED chips will increase market share.
Increase application marketing efforts to carry out the silicon substrate differentiated brand building <br> <br> First, tap the market segments, to avoid the homogenization of competition. Silicon substrate chips are mainly used in "one big and one small", that is, they have great advantages in high-power chips and small-size chip applications. High-power chips should expand the outdoor special LED lighting market, encourage enterprises to further identify the development direction of tunnel sub-division, street lighting, landscape lighting and other sub-application areas; small-size chips should face backlight and display application needs, develop LCD backlight Source and small pitch display market applications. Refine the application of silicon substrate chips to avoid low-cost vicious competition with sapphire chips in the same application.
The second is to target emerging applications and seize the opportunities for development. Pioneering the research and development of silicon-based LED chips in the fields of intelligent lighting systems, eco-agriculture, healthcare, automotive lighting, etc., encourage enterprises to target new application areas to carry out technological innovation and seize opportunities for development. Support the organization of silicon substrate technology related forums, to meet the needs of users, increase publicity, and enhance users' awareness and popularity of silicon substrate chips.
The third is to innovate business models and build their own brands. Encourage silicon-based LED companies to explore new profit models, leverage the advantages of the Internet, online sales, offline experience and services, and enhance cooperation in all aspects of the industry chain. Guide enterprises to identify the market positioning, starting from the aspects of ideology, system construction and capital investment, taking innovation as the core, quality as the life, market as the touchstone, and policy as the support, comprehensively adopting various methods to actively promote silicon Brand building work for substrate chips.
Pay attention to intellectual property protection and improve the silicon substrate LED chip quality inspection system <br> <br> First, innovation-driven technology research and development, strengthen the core patent portfolio. China has more than 200 patents related to silicon-based LED chips, mainly inventing patents. Innovation should be used to drive technological innovation, apply for patents, foster commercial logos, and improve independent intellectual property rights. Encourage enterprises to pay attention to patent layout, with silicon substrate LED technology as the core, and lay out patent networks in various fields such as epitaxial growth, chip manufacturing, packaging and application, and enhance patent barriers to foreign countries.
The second is to formulate an intellectual property strategy to enhance awareness of early warning. The patent war in the LED field has been launched at a glance, and intellectual property has become a means of competition. Enterprises should be encouraged to effectively use intellectual property rights, formulate a strategic system, establish an early warning mechanism for intellectual property rights, monitor patent dynamic information of key foreign competitors, and reduce intellectual property risks in the whole process before, during and after R&D.
The third is to strengthen product quality supervision and improve LED chip testing indicators. At present, the quality of LED chips on the market is mixed. The national and local quality supervision and inspection centers should be strengthened to strengthen market regulation and supervision. The LED chips should be inspected regularly for safety, energy conservation and environmental protection, and public exposure and punishment should be imposed on non-standard enterprises. Enterprises strengthen their own management and technology to improve product quality. Further establish a third-party testing platform with international advanced level to improve testing capabilities and levels.
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