"Semiconductor Lighting Engineering Technician" professional standards

1.1 occupation name

Semiconductor lighting engineering technician

1.2 Career definition

Engaged in the semiconductor lighting industry, manufacturing LED light-emitting diode (LED) chip manufacturing, semiconductor lighting device design and production, research and development of engineering and technical personnel.

1.3 occupational level

From low to high, it is divided into four levels: semiconductor lighting engineering and technical personnel (fourth level) (national vocational qualification level four), semiconductor lighting engineering and technical personnel (level three) (national vocational qualification level three), semiconductor lighting engineering and technical personnel (two Level) (National Vocational Qualification Level 2), Semiconductor Lighting Engineering Technician (Level 1) (National Vocational Qualification Level 1).

1.4 occupational environmental conditions


Indoor and outdoor, normal temperature.

1.5 Professional ability characteristics

Has a good basic knowledge of science and engineering, with comprehensive learning ability, hands-on ability and expressive ability, visual colorless blindness, hearing impediment, and normal olfactory function.

1.6 Basic level of education

Technical secondary school or above (or equivalent)

1.7 Identification requirements

1.7.1 Applicable objects

A person who is engaged in or is preparing to pursue this profession.

1.7.2 Application conditions

Those who meet the following conditions can apply for the four-level professional qualification of this occupation:

1 Hold a secondary vocational school (including secondary school, vocational school, technical school) graduation certificate

2 The standard training hours of the four levels of regular training in this occupation (non-essential)

Those who meet the following conditions can apply for the three-level professional qualification of this occupation:

1 Hold a four-level (intermediate) and above professional qualification certificate, and those who have to hold the certificate for two years or more can participate in the third-level professional qualification.

2 There is no four-level (intermediate) vocational qualification certificate, but those who have accumulated three or more years of work experience in this occupation (type of work) or related professional, who hold a higher education (including undergraduate, junior college, vocational high school) and above, can declare The third-level (advanced) vocational qualification of this profession.

3 After the three levels of formal training in this occupation, the required standard hours (non-essential)

Those who meet the following conditions can declare the secondary vocational qualification of this occupation:

1 Those who hold a three-level vocational qualification certificate for two years or more, who have accumulated five or more years of work experience in this occupation (type of work) or related professions

2 Hold relevant undergraduate degree and above certificates at the same time

3 After the formal secondary training of this occupation, the required standard hours (non-essential)

Those who meet the following conditions can apply for the first-level professional qualification of this occupation:

1 Hold a secondary vocational qualification certificate, and have accumulated a bachelor's degree or above in the occupation (type of work) or related professional work experience for eight years or more.

2. Those who hold a secondary vocational qualification certificate and hold a master's degree or above, who have accumulated five or more years of work experience in this occupation (type of work) or related professional, may directly declare the first-level professional qualification of the occupation.

3 Regular training at the first level of the profession reaches the required standard hours (non-essential)

Related majors include: thin film technology, electronic packaging, electronic and electrical, lighting applications, etc.

Related occupations include: liquid crystal display manufacturers, single-chip processors, semiconductor chip manufacturers, other electronic device manufacturers, quartz crystal growth equipment operators, etc.

1.7.3 Identification method

The semiconductor lighting engineering technicians (four, three, two) adopt non-integrated authentication methods: they are divided into two parts: theoretical knowledge test and operational skill assessment. The theoretical knowledge test adopts the closed-book written test method, and the operational skill assessment adopts the actual operation and practical methods on the spot. Both the theoretical knowledge test and the operational skill assessment are subject to a percentage system, and those with a score of 60 or more are qualified. The semiconductor lighting engineering technicians (level 1) adopt the integrated identification method, integrate the theoretical knowledge test into the assessment of operational skills, and identify them by modules. The percentage system is implemented, and each module has a score of 60 or more.

1.7.4 Equipment for identification sites

Theoretical knowledge test: classrooms with good lighting and lighting.

Operational skill assessment: carried out in the corresponding laboratory of the designated base, and the corresponding experimental testing instruments and equipment conditions are required. Experimental testing equipment: electrical performance tester, optical performance tester, multi-function power tester, consumables preparation including: LED, capacitor, resistor, diode and so on.

Second, the job requirements

2.1 "Occupational function", "work content" list


Professional function

Work content

Semiconductor lighting engineering and technical personnel (four levels)
Semiconductor lighting engineering and technical personnel (level 3)
Semiconductor lighting engineering and technical personnel (secondary)
Semiconductor lighting engineering and technical personnel (level 1)

First, LED (light-emitting diode) chip manufacturing
(1) Growth epitaxy
(2) Making chips

(1) growing an epitaxial layer (2) making a chip

(1) growing an epitaxial layer (2) making a chip

(1) Preparation of semiconductor luminescent materials
(2) Designing the chip structure (3) Making power LED chips

Second, LED chip package

(1) Select LED package structure
(two) choose LED packaging materials
(three) package monochrome LED

(1) Design LED package structure
(two) package LED
(3) Making white LEDs
(4) Detecting LED performance

(1) Monitoring LED package

(1) Designing a power LED package

Third, LED application design

(1) Application areas for dividing LEDs
(2) Making a circuit board
(3) Making LED lighting devices

(1) Select LED
(two) design LED drive circuit
(3) Design LED optical structure

(1) Designing LED lighting devices

(1) Application of dividing power LED
(2) Design and application of power LED

Fourth, organization and management

(1) Production management

(1) Production site management and quality management



2.2 All levels of work requirements

This standard is for the semiconductor lighting engineering and technical personnel (four), semiconductor lighting engineering and technical personnel (three), semiconductor lighting engineering and technical personnel (secondary) and semiconductor lighting engineering and technical personnel (level one) skills requirements in turn, high Levels include low level requirements.

2.2.1 Semiconductor lighting engineering and technical personnel (four levels)


Professional function

Work content

Skill requirement

Professional knowledge requirements

proportion


First, LED chip manufacturing

(1) Growing epitaxial layer

1. Ability to master the epitaxial structure of the LED chip
2. Ability to understand the method of LED epitaxial growth

1. Vacuum technology foundation
2. Thin film technology foundation
3. LED lighting principle


10%

(2) Making chips

1. Can understand the basic structure of the LED chip
2. Can understand the LED chip production process

1. The basis of semiconductor manufacturing process
2. Basic knowledge of photovoltaic materials


10%


Second, LED chip package

(1) Select LED package structure

1. Multiple package structures capable of identifying LEDs
2. Can choose the LED package according to requirements

1. The concept of packaging technology
2. Method of electronic device packaging


6%

(two) choose LED packaging materials

1. Ability to identify basic performance and requirements of LED packaging materials
2. Ability to select the basic materials required for LED packaging

Conductive material
2. Insulation material


6%

(three) package monochrome LED

1. Master the basic structure of a monochrome LED package
2. Ability to operate packaging processes such as dispensing, spotting, wire bonding, and solid bonding

Packaged device operating program
2. Process of electronic device packaging


8%

Third, LED application design

(1) Application areas for dividing LEDs

1. Different application areas for LEDs can be correctly divided
2. Ability to distinguish LED application characteristics in the field of lighting

Lighting knowledge
2. LED performance


5%

(2) Making a circuit board

1. Ability to use the welding equipment and electronic components for circuit board production according to the circuit diagram
2. Ability to read basic LED driver circuits

1. Basic knowledge of electronic circuits
2. LED lighting principle


30%

(3) Making LED lighting devices

1. Ability to make LED lighting devices using circuit modules and lighting housings
2. Ability to debug basic LED lighting devices

Lighting knowledge
2. Electronic circuit and electrical foundation



twenty two%
Related basics

Professional ethics
2. Safety knowledge


3%
2.2.2 Semiconductor lighting engineering and technical personnel (level 3)

Professional function

Work content

Skill requirement

Professional knowledge requirements

proportion


First, LED chip manufacturing

(1) Growing epitaxial layer

1. Ability to master the method of LED epitaxial growth
2. Easy to operate vacuum coating equipment

1. Vacuum technology foundation
2. Thin film technology foundation
3. Vacuum equipment knowledge


15%


(2) Making chips

1. Ability to perform basic operations of the LED chip fabrication process
2. Ability to master the basic structure of the LED chip
3. Ability to master the clean room usage rules

1. The basis of semiconductor manufacturing process
2. Basic knowledge of photovoltaic materials
3. Clean room usage rules


10%


Second, LED chip package

(1) Design LED package structure

1. Ability to master multiple package structures of LEDs
2. Ability to design the shape of the bracket and sealant using optical principles

Optical principle
2. Packaging materials

10%


(two) package LED

1. Equipment capable of operating LED packages correctly
2. Proficiency in LED packaging, dot, lead, and solid packaging operations

1. Automation equipment foundation
2. The basic process of electronic device packaging

8%


(3) Making white LEDs

1. Can understand how to make white LEDs 2. Can use suitable phosphors to make white LEDs

1. Principle of phosphor light emission
2. Standard chromaticity diagram

7%


(4) Detecting LED performance

1. Ability to detect LED light intensity, luminous efficiency, beam angle, color temperature, spectrum and other optical properties
2. Ability to detect LED forward voltage, forward current, reverse breakdown voltage, reverse leakage current and other electrical properties

Lighting term
2. Diode parameters
3. Photoelectric performance testing knowledge

7%


Third, LED application design


(1) Select LED

1. Ability to master LED requirements in different application areas
2. Ability to select suitable LEDs for different application fields

Lighting knowledge
2. Color design
3. LED performance characteristics


15%


(two) design LED drive circuit

1. Can use drawing LED driver circuit diagram
2. Ability to design basic LED driver circuits

1. Electronic circuit design basis
2. Analog circuit knowledge


15%


(3) Design LED optical structure

1. Ability to design LED luminaires using geometric optics
2. Ability to design integrated LED lighting devices

Geometric optics
2. Lighting knowledge


10%

Related basics


Professional ethics


2. Safety knowledge


3%



2.2.3 Semiconductor Lighting Engineering Technician (Level 2)


Professional function

Work content

Skill requirement

Professional knowledge requirements

proportion


First, LED chip manufacturing

(1) Growing epitaxial layer

1. Ability to perform vapor phase epitaxy and MOVPE growth of LED chips
2. Ability to perform liquid phase epitaxy of LED chips
3. Can solve general technical problems in epitaxial growth


1. Vacuum technology foundation
2. Thin film technology foundation
3. Semiconductor doping technology


25%


(2) Preparing chips

1. Ability to lithography and etch LED epitaxial wafers
2. Ability to prepare electrodes using vacuum coating technology

1. The basis of semiconductor manufacturing process
2. Vacuum coating technology


twenty two%


Second, LED chip package


(1) Monitoring the packaging process

1. Can solve more complicated technical problems in the packaging process
2. Ability to perform LED reliability testing

Photovoltaic device package
2. Reliability testing


20%


Third, LED application design


(1) Designing LED lighting devices

3. Ability to design LED lighting devices
4. Can complete some small semiconductor lighting projects independently

Geometric optics
2. Electronic Technology Foundation


20%

Fourth, production management

(1) Production management

1. Understand the main points of the factory layout and arrange the production line
2. 2. Can supervise machine maintenance and industrial safety

Factory layout
2. Machine maintenance
3. Industrial safety



10%
Related basics

Professional ethics
2. Safety knowledge
3. Environmental protection knowledge


3%



2.2.4 Semiconductor lighting engineering and technical personnel (level 1)


Professional function

Work content

Skill requirement

Professional knowledge requirements

proportion

First, LED chip manufacturing


(1) Preparation of semiconductor luminescent materials

1. Capable of MOCVD epitaxial growth of LED chips and optimization of material luminescence properties
2. Ability to perform vacuum coating and etching process operations
3. Can solve complex technical problems in the growth of thin film materials of light-emitting layer and electrode layer

Material science foundation
2. Thin film technology foundation
3. Semiconductor photoelectric material epitaxy process


27%

(2) Designing a power chip structure


1. Ability to distinguish the characteristics of different chip structures
1. 2. Ability to design optimized chip structures to improve optoelectronic performance

1. The basis of semiconductor manufacturing process
2. 2. Vacuum coating technology


20%

Second, LED chip package

(1) Designing a power LED package

1. Can accurately select the packaging material of the appropriate power LED
2. Ability to design package structure and package form of power LED


1. Optoelectronic device packaging materials
2. Method of electronic device packaging

15%


Third, LED application design


(2) Design and application of power LED

1. Master the characteristics of power LED applications
2. Ability to design power LED light sources for general illumination

Optical principle
2. Electronic circuit design


15%

Fourth, organization and management

(1) Management of production site and management quality

1. Understand the meaning and content of production site management
2. Can participate in the organization and management of the production site
3. Can find common problems and misunderstandings in the production site

Production site management
2. Quality management



20%

Related basics

Professional ethics

2. Safety knowledge

3. Relevant legal knowledge


3%


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