Infineon has introduced a complete 77/79 GHz radar chipset tailored for early adopters, designed to accelerate the development of advanced radar systems. This comprehensive solution includes a 77/79 GHz monolithic microwave integrated circuit (MMIC), a high-performance multicore microcontroller with a dedicated sensor processing unit, and a secure power chip. The chipset is built to support next-generation automotive applications, offering a scalable and reliable platform for developers.
According to Ritesh Tyagi, head of Infineon's Silicon Valley Automotive Innovation Center (SVIC), the pace of innovation in the automotive sector has never been faster, with many tech-driven companies from Silicon Valley leading the charge in shaping the future of mobility. "We are witnessing a significant shift in how automotive technology is being developed, and our focus is on delivering cutting-edge solutions that meet the evolving needs of the industry," he said.
The RF radar single-chip transceiver in this chipset replaces three traditional components: RF transmitters, RF receivers, and phase-locked loop (PLL) devices. By integrating these functions into a single chip, Infineon simplifies system design while improving performance and reliability. Combined with its second-generation AURIX radar-specific microcontrollers and fail-safe power supplies, this radar chipset ensures full compliance with ISO26262 standards, making it ideal for safety-critical applications.
To further support automotive system suppliers and innovators, Infineon plans to release a radar module kit in Q1 2018. This kit will include the three key ICs—RF radar transceiver, AURIX microcontroller, and safety power supply—as well as an integrated software package. The evaluation kit will help developers leverage the dedicated signal processing hardware within the chipset, enabling faster and more efficient development of radar sensors.
In addition to radar chips, Infineon is expanding its sensor portfolio to support semi-automated and fully autonomous vehicles. The company is offering two additional core sensors: a camera based on time-of-flight (ToF) 3D image sensor technology and a LiDAR chip. These sensors will play a crucial role in enhancing vehicle perception and situational awareness.
Infineon’s Real3 family of 3D ToF image sensors represents a breakthrough in driver monitoring and environmental sensing. Developed in collaboration with PMD Technologies, these highly integrated single-chip sensors combine PMD’s advanced ToF pixel matrix with Infineon’s proven CMOS process. The result is a compact, high-performance solution capable of capturing detailed 3D data for applications such as detecting driver distraction, drowsiness, and facial expressions.
Infineon also acquired Innoluce in 2016, a Dutch company specializing in solid-state laser scanning modules using resonant MEMS mirrors. This acquisition strengthens Infineon’s position in the LiDAR market. The MEMS-based LiDAR system offers advantages over traditional mechanical designs, including smaller size, greater durability, and lower cost. Innoluce’s 1D MEMS mirror technology provides higher horizontal resolution, better temperature stability, and reduced vibration sensitivity compared to 2D systems. Infineon aims to leverage this technology to develop high-performance LiDAR components that can be integrated into mass-produced vehicles.
As the automotive industry continues to evolve, Infineon remains at the forefront of innovation, providing essential components that enable safer, smarter, and more connected vehicles. From radar and LiDAR to 3D imaging sensors, the company is driving the future of autonomous driving.
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