Introduction of COMMB-LED high-efficiency integrated surface light source technology (Figure)

First, the technical background

LED light source is the focus of the 21st century light source market. As a new type of energy-saving and environmentally-friendly green light source product, LED is bound to be the future development trend, and it is called the fourth generation new light source revolution. It has the advantages of long life, high luminous efficiency, high stability, good safety, no mercury, no radiation, low power consumption and so on. However, the lack of high-efficiency and low-cost integrated light source industry technology is currently the bottleneck restricting the rapid development of white LED indoor general illumination at home and abroad, and is a common problem to be solved.

The packaging technology "COMMB-LED high-efficiency integrated surface light source" is a unique and innovative technology form of the LED industry. It has independent intellectual property rights and is protected by patent clustering formed by numerous patents and software copyrights. Its high cost performance characteristics. It will gradually become the mainstream packaging technology for the entire LED indoor lighting source.

The meaning of COMMB-LED light source technology is explained as the high-efficiency integrated surface light source technology of LED chip directly attached to the high-reflection mirror metal substrate. This technology eliminates the bracket concept, electroless plating, no reflow soldering, no patching process, so The process is reduced by nearly one-third and the cost is saved by one-third.

Second, the domestic LED industry technology level

Currently, LED packaging is available in a variety of forms. However, the overall application of semiconductor packaging technology to adapt to different applications, different dimensions, heat dissipation schemes and lighting effects, the package form is also different. LEDs are classified into package types, such as Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, and COB LED.

In general, COB LED packaging technology is the mainstream technical solution for LED general lighting industry that is recognized by domestic and foreign industries. The LED general lighting industry in the world is striving to find cost-effective production solutions.

However, in the above package form, no matter what kind of LED, it is necessary to design a reasonable package form for different application occasions and lamp types, because only the cost performance and the comprehensive performance of the light source can be packaged as the light source product of the terminal, so that a good practical application can be obtained. Different from the above several package forms, the high-efficiency and low-power integrated package indoor lighting source built by our company's 39 patent groups adopts the vertical integration and packaging technology of chips and lamps, and is self-contained, widely used in indoor lighting such as LED lights. Tube, LED bulb, downlight, etc. It has a high degree of integration, greatly reducing the packaging process and the assembly process of the luminaire, improving the automation and operation efficiency, reducing the cost and improving the reliability of the product quality. Not only the products are environmentally friendly, but also the production process is clean, low noise and no pollution.

Third, the development trend of LED package light efficiency


As can be seen from the above figure: In 2011, the single LED light efficiency has reached the package level of 150Lm/W, and it is expected to reach the level of 200Lm/W by 2013. It will be three times that of the current fluorescent energy-saving lamps! Therefore, the use of high-efficiency dysfunction has been eliminated, and cost reduction has become a major obstacle to popularization.

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