Microsemi CorporaTIon, a leading provider of differentiated semiconductor technology solutions for power, safety, reliability and performance, announces the availability of a new LiteFast solution, a proprietary lightweight, high-speed, Low hysteresis, point-to-point serial communication protocol. Embedded systems covering a wide range of applications use high-speed serial interfaces and protocols to deliver data at rates exceeding 1 Gbps. LiteFast leverages the SmartFusionTM2 System-on-Chip (SoC) Field Programmable Logic Device (FPGA), IGLOOTM2 FPGA, and RTG4TM High-Speed ​​Signal Processing Serializer/Deserializer (SerDes) Transceiver Module in Radiation Hardened FPGA Devices Simple implementation of high-speed serial links, driving customers to reduce design work and time to market, without the need for heavy logic utilization, greatly reducing cost and power.
Chowdhary Musunuri, senior director of design services and solutions at Microsemi, said: "LiteFast allows customers to easily integrate additional features by providing a pre-integrated intellectual property (IP) core, an IP reference design, and a graphical user interface (GUI) demonstration. In the US-based high-sensitivity FPGA device, a lightweight serial communication protocol is implemented in the application. Customers who want to avoid the overhead of existing standards such as Serial RapidIO, Serial Ethernet or PCIe can now use Microsemi's LiteFast This makes this solution an ideal pre-validation option for a cost-effective, high-speed, low-lag, point-to-point solution that requires viability."
Microsemi's new IP solution is designed for applications requiring high-speed serial communication links, including backplane/control board, chip-to-chip and board-to-board applications, high-performance bridging solutions, network interface cards, enterprise switches, data Center and medical applications. In addition, aerospace customers can benefit from LiteFast's easy implementation of multiple high-speed serial links for wired connectivity applications, helping to increase system-level bandwidth.
Chaitanya Kumar, Principal Analyst and CEO of market research firm IndustryARC, points out that back-to-board boards and line cards are increasingly used in medical and industrial systems worldwide to achieve system modularity and scalability, and use high-speed serial Interface to easily transfer data. The market research firm's key medical product research since 2015 shows that the global market for imaging, surgical and patient care equipment is expected to grow at a rate of 5.7% between 2015 and 2020.
In addition to medical applications, LiteFast is also suitable for target markets including networking, data centers, industrial and aerospace, and supports the company's goal of enhancing the high-speed serial interface SerDes solution portfolio. This solution has a pre-integrated, proven IP core (transmitter and receiver), demo design and complete documentation to reduce design time and verification time. The Libero SoC Design Suite, a comprehensive easy-to-learn, easy-to-use development tool suite designed for Microsemi's high-performance FPGA and SoC FPGA devices, makes it easy to reuse designs across multiple platforms. Moreover, LiteFast uses the SmartFusion2 Security Evaluation Suite with 90K logic unit (LE) SmartFusion2 SoC FPGA devices for hardware platform verification.
Main characteristics
Support for x 1 , x 2 and x 4 channels in SerDes devices
Very little FPGA logic resource usage (lightweight)
Low hysteresis
Idle frames are used to establish links, and data frames are used to transmit data.
Send idle frames when no data is transmitted
Built-in flow control, word alignment, block alignment, Lane alignment, and support for hot swap
Serial full-duplex or simplex operation
Flow control through token ring switching
Product supply
Microsemi offers the LiteFast solution now. For more information, please visit the company website or contact sales.
About Microsemi's IGLOO2 FPGA and SmartFusion2 SoC FPGA
Microsemi's IGLOO2 FPGAs and SmartFusion2 SoCFPGAs provide more resources in low-density devices with lowest power consumption, proven security and outstanding reliability. These devices are 30-50% more power efficient for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging, input/output (I/O) expansion and conversion, and video/image processing , system management and secure connection applications. Microsemi's FPGA and SoC FPGA device users are in the communications, industrial, medical, defense and aerospace markets. The PCIe Gen 2 connectivity product has a minimum of 10 K logic components (LE). The SmartFusion2 SoC FPGA offers a 166MHz ARM Cortex-M3 processor with up to 512KB of embedded flash and comprehensive peripherals. The IGLOO2 FPGA provides a high-performance memory subsystem with 512KB of embedded flash, 2 x 32 KB embedded static random access memory (SRAM), two direct memory access (DMA) engines, and two double data rate (DDR) controllers. Microsemi also offers a wide range of military, automotive and aerospace grade FPGAs and SoC FPGAs. For more information, please visit the company website.
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